Experimental Investigation of Solar Panel Cooling by a Novel Micro Heat Pipe Array
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چکیده
منابع مشابه
Experimental Investigation of Heat Transfer Enhancement in a Finned U-Shaped Heat Pipe of CPU Cooling System Using Different Fluids
This paper experimentally studies the heat absorption performance of a heat sink with vertical embedded heat pipes in the aluminum blade. The cooling system with embedded heat pipes distributes heat from the CPU to both the base plate and the heat pipes, and then transfer heat from fins to the Environment. The thermal resistance and heat transfer coefficient are evaluated for natural convection...
متن کاملAn experimental investigation of heat transfer of Fe2O3/Water nanofluid in a double pipe heat exchanger
One way to increase the heat transfer is to use perforated twisted tapes with different hole diameters, which largely improve heat transfer with an increase in the heat transfer area at the constant volume and more mixed flow. In the previous studies, the effect of nanofluids with perforated twisted tapes is less studied. In this work, the performance of water / iron oxide nanofluid in a double...
متن کاملAn experimental investigation of heat transfer of Fe2O3/Water nanofluid in a double pipe heat exchanger
One way to increase the heat transfer is to use perforated twisted tapes with different hole diameters, which largely improve heat transfer with an increase in the heat transfer area at the constant volume and more mixed flow. In the previous studies, the effect of nanofluids with perforated twisted tapes is less studied. In this work, the performance of water / iron oxide nanofluid in a double...
متن کاملInvestigation of Packaged Miniature Heat Pipe for Notebook PC Cooling
Miniature heat pipe (MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP on the very limited space of a notebook PC. A cross-sectional area of the pipe is reduced about 30% when the MHP with 4mm diameter is pressed to 2mm thickness. In this study, a performance test has been performed in order to r...
متن کاملExperimental Investigation on Thermal Performance of Cooling System Using Thermoelectric Module Integrated with Heat Pipe
ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging iss...
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ژورنال
عنوان ژورنال: Energy and Power Engineering
سال: 2010
ISSN: 1949-243X,1947-3818
DOI: 10.4236/epe.2010.23025